Practice Packaging And Interconnects (9.3.3) - MEMS Integration and System Design

Practice: Packaging and Interconnects

Lesson 9.3.3MEMS Integration and System Design

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10 questions

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Quiz
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6 sample questions

Question 1.
What is the purpose of hermetic sealing in MEMS packaging?
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Think about what keeps devices dry.
Question 2.
Name one technique used for interconnecting MEMS devices.
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Consider standard electrical connection methods.
3Question 3.
What is the main role of packaging in MEMS?
- To allow for digital processing
- To protect the MEMS device
- To provide power
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Consider what protects electronics in general.
4Question 4.
True or False: Thermal management is not important for MEMS devices.
- True
- False
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Think about overheating methods.
Question 5.
Design a MEMS packaging concept for a high-precision sensor used in a drone. Consider factors such as protection, thermal management, and interconnect techniques.
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Think about what conditions a drone might face that could harm a sensor.
Question 6.
Evaluate the impact of poor hermetic sealing on the functionality of a MEMS accelerometer. Consider how this might affect its applications.
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Consider specific environments where moisture could be a problem.

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