Practice Etching Techniques (8.3.3) - Materials and Processes in MEMS Fabrication

Practise this section

9 questions

Flashcard drill
5 cards from this section. Quick, good the night before a test.
Exercise
6 questions · about 4 min · pass mark 70%. Hints available.
Sign up to start the exercise
Quiz
3 questions · about 2 min · pass mark 70%. Hints available.
Sign up to start the quiz

6 sample questions

Question 1.
What is the primary purpose of wet etching?
Show hintHide hint
Think about the process that involves using liquid chemicals.
Question 2.
Name one characteristic of dry etching.
Show hintHide hint
Recall the method that doesn't involve liquids.
3Question 3.
What is one advantage of dry etching?
- Less expensive
- High precision
- Fast process
Show hintHide hint
Consider which method allows for better control.
4Question 4.
True or False: Wet etching can be both isotropic and anisotropic.
- True
- False
Show hintHide hint
Recall the definitions of isotropic and anisotropic.
Question 5.
Design a MEMS structure that utilizes both wet etching and dry etching techniques. Discuss the benefits of each approach in your design.
Show hintHide hint
Consider how the properties of each etching method complement one another.
Question 6.
Explain a scenario where sacrificial layer etching could create a critical flaw in a MEMS device and how to mitigate it.
Show hintHide hint
Think about interactions between layers during etching.

5 more questions in this section. Enroll free to practise them all.