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4 cards from this section. Quick, good the night before a test.
What is anodic bonding?
Think about bonding glass to silicon.
What does fusion bonding achieve?
Consider the temperature used in the process.
What type of bonding uses heat and an electric field?
This is the type involving glass.
True or False: Adhesive bonding is used exclusively for silicon-to-silicon bonding.
Think about the flexibility of materials used.
Propose a suitable bonding method for a microfluidic device and justify your choice based on application needs.
Focus on the need for integrating diverse materials.
Analyze the impact of high temperature in fusion bonding on the structural integrity of MEMS devices.
Consider both the advantages and disadvantages of heat.
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